Lucintel’s latest market report analyzed that system in package provides attractive opportunities in the automotive & transportation, healthcare, communication, aerospace & defense, industrial, and consumer electronics applications. The system in package market is expected to grow at a CAGR of 8% to 10%. In this market, RF front end is the largest segment by device type, whereas consumer electronics is largest by application.
Download Brochure of this report by clicking on https://www.lucintel.com/system-in-package-market.aspx Based on device type, the system in package market is segmented into RF front-end, RF power amplifier, power management integrated circuits, baseband processor, application processor, microelectromechanical system, and others. The RF front end segment accounted for the largest share of the market in 2020 and is expected to register the highest CAGR during the forecast period, due to rising demand for compact size and high frequency transceiver solutions in various electronics products such as smartphones and tablets.
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The System in Package Market is marked by the presence of several big and small players. Some of the prominent players offering system in package include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group.
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