According to the new market research report on “Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography – Global Forecast to 2023″, During the projection period, the substrate-like PCB market is estimated to increase at a compound annual growth rate (CAGR) of 15.6 percent, from USD 1.1 billion in 2018 to USD 2.6 billion in 2024. The high adoption of SLPs by leading OEMs, the spike in demand for smart consumer electronics and wearable devices, and the huge benefits of SLP are just a few of the primary drivers propelling the substrate-like PCB market forward.
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Browse 36 market data Tables and 49 Figures spread through 120 Pages and in-depth TOC on “Substrate-Like PCB Market – Global Forecast to 2023″View detailed Table of Content here – https://www.marketsandmarkets.com/Market-Reports/substrate-like-pcb-market-102960724.html
Line space of 25/25 & 30/30 µm to hold major share of substrate-like PCB market during forecast period
Line space of 25/25 & 30/30 µm is expected to hold the largest market share for the SLP market based on the line/space segment. Most of the consumer electronics devices, such as smart bands, smartphones, and fitness trackers, are battery operated and demand for more battery capacity. To increase the battery capacity, the size of the PCB should be compromised. SLPs can be used to do this, and the line/space can be lowered to 25/25 m or 30/30 m. As a result, smartphone makers such as Apple and Samsung employ SLPs, which allow for the use of larger batteries. SLPs can set aside more space for other components due to the more detailed, smaller area. HDI PCBs used to require a line/space of 50/50 m, but now, thanks to the introduction of mSAP, line/space of up to 25 m is possible.
Consumer electronics application to dominate substrate-like PCB market during forecast period
The consumer electronics application is expected to hold the largest market share of the substrate-like PCB market. Consumer electronics includes smartphones, tablets, smart bands, fitness bands, wearables, and others. Increasing demand for consumer electronics expected to provide opportunities to players in the SLP market. Due to the increasing power consumption in consumer electronics applications, batteries need to get bigger, while boards need to get smaller; SLP is seen as an element that can satisfy both the conditions simultaneously. Moreover, with the implementation of 5G, there will be a demand for sophisticated PCBs, which will drive the SLP market forward in the next years. The usage of SLP in a smartphone will allow for thinner connections between important components such as the DRAM, NAND flash memory, and application processor, allowing for greater battery space. The number of layers can be raised using SLP, resulting in a 30% reduction in board area and width compared to the previous one. Kinsus, Ibiden, Compeq, Unimicron, AT&S, ZD Tech, and Samsung Electro-Mechanics are all major SLP suppliers.
APAC to hold major share of substrate-like PCB market by 2024
APAC is an emerging market for substrate-like PCBs. APAC is expected to hold the largest size of the substrate-like PCB market during the forecast period due to the high adoption of SLP-based products in consumer electronics such as smartphones, and strong presence of major smartphone players such as Samsung, Huawei, Oppo, and Vivio in this region. APAC has become a global focal point for large investments and business expansion opportunities. More than 50% of the global mobile subscribers live in APAC—mostly in China and India. There has been a paradigm shift of users from 3G to 4G technology in this region. Asian markets are encouraging the development of 5G mobile technologies with commercial deployments planned in South Korea in 2019, and Japan and China in 2020.
AT&S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck Electronics (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); LG Innotek (South Korea) are major players in the substrate-like PCB market.
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